Plasma is a mechanism of action
Plasma treatment removes organic matter from the surface and modifies the surface, facilitates Epoxy flowability and eliminates undisturbed and clumping defects
Effect of plasma application
Improvement of VCM attachment defects due to undiffusion and clumping defects after Epoxy bonding
Existing process Flow
On the PCB base
Epoxy bonding
VCM
Attach
Improvement process Flow
on the PBC base
Plasma processing
Epocy
bonding
VCM
Attach