Plasma is a mechanism of action

Plasma treatment removes organic matter from the surface and modifies the surface, facilitates Epoxy flowability and eliminates undisturbed and clumping defects

Effect of plasma application

Improvement of VCM attachment defects due to undiffusion and clumping defects after Epoxy bonding

Existing process Flow

On the PCB base
Epoxy bonding

VCM
Attach

Improvement process Flow

on the PBC base
Plasma processing

Epocy
bonding

VCM
Attach