Plasma Solution> deposition

PECVD

depositing other materials on a substrate on a basic material using plasma

low temperature

rapid velocity

flexibility

Plasma Solution Deposition

deposition

O2 Gas(sccm)
05102040
Bubbling
Ar(sccm)
200No.1No.2
400No.3No.4No.5No.6
[process condition] Ionizer
Utilities: N₂ plasma/1500m conveyor
processing equipment: N₂, Ar
processing speed: 30mm/sec
Number of treatment: 1 time a one-way

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